Design, FEA-Based Physical Insights, and Experimental Verification of a Planar Transformer for Two-Switch Flyback Converters
DOI:
https://doi.org/10.18618/REP.e202623Keywords:
Finite element analysis, Double-switch flyback, Planar transformer, AC resistance, Leakage inductance, Stray capacitanceAbstract
Parasitic parameters in high-frequency transformers directly impact losses, electromagnetic interference (EMI), and voltage/current stresses in power converters. This paper presents a comparative analysis and optimization of planar transformers (PT) applied to a two-switch Flyback (TSF) converter. The investigation focuses on balancing leakage inductance, AC resistance, and parasitic capacitances through different PCB winding arrangements using multiphysics Finite Element Analysis (FEA). By employing a structured analysis that correlates electromagnetic and thermal modeling with experimental validation, this work demonstrates how layer alignment and interleaving mitigate proximity effects and drastically reduce ringing in semiconductor switches. The results show that the optimized configuration achieved an 80% reduction in leakage inductance and a 57% reduction in AC resistance compared to conventional designs, resulting in an efficiency of 89.2% and a significant decrease in thermal stress. The study provides evidence-based design guidelines for mitigating parasitic effects in high-power-density converters.
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Copyright (c) 2026 Naelton O. de Souza, Djonny Weinzierl, Maicon W. M. de Carvalho, Rodrigo Heinrich, Sergio V. G. Oliveira

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