Mission Profile Emulator for MMC-based Battery Energy Storage Systems
DOI:
https://doi.org/10.18618/REP.2022.2.0035Keywords:
Design Validation, Mission Profile Emulators (MPE), MMC-based BESS, Modular Multilevel Converter (MMC), Testing SchemeAbstract
In recent years, Modular Multilevel Converters (MMC) have been widely used in medium/high voltage applications, such as high-voltage direct current (HVDC) systems, and pointed out as a promising solution for battery energy storage systems (BESS) and static synchronous compensators (STATCOM), according to recent research. Especially, in BESS application, the current and voltage conditions in the battery bank are fundamental to evaluate thermal dynamic, reliability, and lifetime. However, depending on the voltage and power levels, MMC is based on hundreds of SMs. Thus, the full MMC system implementation can be costly and complex for operational and reliability tests. In this sense, the so-called mission profile emulators (MPE), have been developed to emulate the voltage and current in an SM and batteries. The MPE eliminates the need to implement the full converter and contributes to more agile tests of the MMC dynamics, resulting in the design of more reliable converters. In addition, the MPE can be used to obtain battery current and arm current spectrum similar to those obtained in MMC. This work presents a detailed design and implementation of the MPE for an MMC-based BESS. The MPE is validated in simulations and in a reduced-scale prototype.
Downloads
References
S. Debnath, J. Qin, B. Bahrani, M. Saeedifard, P. Barbosa, "Operation, Control, and Applications of the Modular Multilevel Converter: A Review", IEEE Trans on Power Electr, vol. 30, no. 1, pp. 37-53, mar. 2015. https://doi.org/10.1109/TPEL.2014.2309937 DOI: https://doi.org/10.1109/TPEL.2014.2309937
Y. Xuan, X. Yang, "A novel circuit topology for the VSC-HVDC submodules testing", in IFEEC 2017 - ECCE Asia, pp. 1435-1439, oct. 2017.
C. A. Bharadwaj, S. Maiti, "Modular multilevel converter based hybrid energy storage system", 2017 IEEE PES APPEEC, pp. 1-6, mar. 2017. https://doi.org/10.1109/APPEEC.2017.8308983 DOI: https://doi.org/10.1109/APPEEC.2017.8308983
G. Wang, G. Konstantinou, C. D. Townsend, J. Pou, S. Vazquez, G. D. Demetriades, V. G. Agelidis, "A Review of Power Electronics for Grid Connection of Utility-Scale Battery Energy Storage Systems", IEEE Trans on Sustain Energy, vol. 7, no. 4, pp. 1778-1790, jul. 2016 https://doi.org/10.1109/TSTE.2016.2586941 DOI: https://doi.org/10.1109/TSTE.2016.2586941
K. Sharifabadi, L. Harnefors, H. Nee, S. Norrga, R. Teodorescu, "Design, Control, and Application of Modular Multilevel Converters for HVDC Transmission Systems", Wiley - IEEE, jan. 2016. https://doi.org/10.1002/9781118851555 DOI: https://doi.org/10.1002/9781118851555
A. F. Cupertino, J. V. Farias, H. Pereira, S. I. Seleme, R. Teodorescu, "DSCC-MMC STATCOM Main Circuit Parameters Design Considering Positive and Negative Sequence Compensation", J of Control, Autom and Electr Syst, vol. 29, pp. 62-74, nov. 2018. https://doi.org/10.1007/s40313-017-0349-4 DOI: https://doi.org/10.1007/s40313-017-0349-4
J. H. D. G. Pinto, W. C. S. Amorim, A. F. Cupertino, H. A. Pereira, S. I. S. Junior and R. Teodorescu, "Optimum Design of MMC-Based ES-STATCOM Systems: The Role of the Submodule Reference Voltage," in IEEE Transactions on Industry Applications, vol. 57, no. 3, pp. 3064-3076, May-June 2021, doi: 10.1109/TIA.2020.3032381. https://doi.org/10.1109/TIA.2020.3032381 DOI: https://doi.org/10.1109/TIA.2020.3032381
F. Mohamad, J. Teh, "Impacts of Energy Storage System on Power System Reliability: A Systematic Review", Energies, vol. 11, no. 7, jul. 2018. https://doi.org/10.3390/en11071749 DOI: https://doi.org/10.3390/en11071749
H. Wang, M. Liserre, F. Blaabjerg, "Toward Reliable Power Electronics: Challenges, Design Tools, and Opportunities", IEEE Industrial Electronics Magazine, vol. 7, no. 2, pp. 17-26, jun. 2013. https://doi.org/10.1109/MIE.2013.2252958 DOI: https://doi.org/10.1109/MIE.2013.2252958
Y. Zhang, H. Wang, Z. Wang, Y. Yang, F. Blaabjerg, "Impact of lifetime model selections on the reliability prediction of IGBT modules in modular multilevel converters", in 2017 - ECCE, pp. 4202-4207, nov. 2017. https://doi.org/10.1109/ECCE.2017.8096728 DOI: https://doi.org/10.1109/ECCE.2017.8096728
Y. Zhu, K. Ma, X. Cai, "Thermal Characterization Method of Power Semiconductors Based on H-Bridge Testing Circuit", IEEE Trans on Power Electr, vol. 34, no. 9, pp. 8268-8273, feb. 2019. https://doi.org/10.1109/TPEL.2019.2900253 DOI: https://doi.org/10.1109/TPEL.2019.2900253
F. Hahn, M. Andresen, G. Buticchi, M. Liserre, "Mission Profile Based Reliability Evaluation of Building Blocks for Modular Power Converters", in PCIM Europe 2017, pp. 1-7, may. 2017.
N. Ahmed, L. ̈Angquist, S. Norrga, A. Antonopoulos, L. Harnefors, H. Nee, "A Computationally Efficient Continuous Model for the Modular Multilevel Converter", IEEE J of Emerg and Sel Topics in Power Electron, vol. 2, no. 4, pp. 1139-1148, jun. 2014. https://doi.org/10.1109/JESTPE.2014.2332041 DOI: https://doi.org/10.1109/JESTPE.2014.2332041
Y. Tang, L. Ran, O. Alatise, P. Mawby, "A Model Assisted Testing Scheme for Modular Multilevel Converter", IEEE Trans on Power Electron, vol. 31, pp. 165-176, mar. 2016. https://doi.org/10.1109/TPEL.2015.2411694 DOI: https://doi.org/10.1109/TPEL.2015.2411694
Y. Tang, O. Alatise, L. Ran, P. Mawby, "Improved Testing Capability of the Model-Assisted Testing Scheme for a Modular Multilevel Converter", IEEE Trans on Power Electron, vol. 31, pp. 7823-7836, nov. 2016. https://doi.org/10.1109/TPEL.2016.2514439 DOI: https://doi.org/10.1109/TPEL.2016.2514439
Y. Yang, K. Ma, Y. Song, W. Wang, "Control and Design of Mission Profile Emulator for Sub-modules in Modular Multilevel Converter", 2019 ECCE, pp. 4789-4794, nov. 2019. https://doi.org/10.1109/ECCE.2019.8912482
S. Jiang, K. Ma, X. Cai, "Self-Circulating Testing Method for Both Rectifying and Inverting Submodules of Modular Multilevel Converter With Low DC Supply Voltage", IEEE Trans on Power Electr, vol. 35, no. 8, pp. 7795-7803, aug. 2020. https://doi.org/10.1109/TPEL.2019.2963358 DOI: https://doi.org/10.1109/TPEL.2019.2963358
Y. Yang, W. Wang, K. Ma, "Mission-Profile-Based Testing Scheme for Sub-Modules in Modular Multilevel Converter", IEEJ J of Industry Applic, vol. 9, no. 3, pp. 219-226, may 2020. https://doi.org/10.1541/ieejjia.9.219
Z. Wang, H. Wang, Y. Zhang, F. Blaabjerg, "A Viable Mission Profile Emulator for Power Modules in Modular Multilevel Converters", IEEE Trans on Power Electron, vol. 34, pp. 11580-11593, mar. 2019. https://doi.org/10.1109/TPEL.2019.2908405 DOI: https://doi.org/10.1109/TPEL.2019.2908405
Y. Yang, K. Ma, W. Wang, "Mission Profile Emulator for Sub-Modules of Modular Multilevel Converter with Carrier Phase-Shift Modulation", ICPE 2019 - ECCE Asia, pp. 1836-1841, aug. 2019. https://doi.org/10.1109/ECCE.2019.8912482 DOI: https://doi.org/10.1109/ECCE.2019.8912482
J. Tang, Y. Dong, H. Yang, W. Li, X. He, J. Ma, G. Chen, Y. Tian, E. Yang, "An equivalent power test scheme for modular multilevel converters (MMCs)", mar 2017 IEEE APEC, pp. 1837-1842, 2017. https://doi.org/10.1109/APEC.2017.7930948 DOI: https://doi.org/10.1109/APEC.2017.7930948
Y. Yang, W. Wang, K. Ma, "Mission-Profile-Based Testing Scheme for Sub-Modules in Modular Multilevel Converter", IEEJ Journal of Ind Appl, vol. 9, pp. 219-226, oct. 2020. https://doi.org/10.1541/ieejjia.9.219 DOI: https://doi.org/10.1541/ieejjia.9.219
Z. Wang, H. Wang, Y. Zhang, F. Blaabjerg, "A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters", 2019 APEC, pp. 313-318, may 2019. https://doi.org/10.1109/APEC.2019.8721785 DOI: https://doi.org/10.1109/APEC.2019.8721785
S. Jiang, K. G. Ma, Y. Yang, X. Cai, "Mission Profile Emulator for Individual Submodule in Modular Multilevel Converter with Nearest Level Control", IEEE Trans on Power Electr, pp. 1-1, mar. 2021. https://doi.org/10.1109/TPEL.2021.3063536 DOI: https://doi.org/10.1109/TPEL.2021.3063536
K. Ma, S. Jiang, E. Li, X. Cai, "Three-Phase Mission Profile Emulator for Multiple Submodules in Modular Multilevel Converter", IEEE Trans on Power Electr, vol. 36, no. 5, pp. 5213-5222, oct. 2021. https://doi.org/10.1109/TPEL.2020.3029373 DOI: https://doi.org/10.1109/TPEL.2020.3029373
L. Harnefors, A. Antonopoulos, S. Norrga, L. Angquist, H.-P. Nee, "Dynamic Analysis of Modular Multilevel Converters", IEEE Trans on Industrial Electr, vol. 60, no. 7, pp. 2526-2537, jul. 2013. https://doi.org/10.1109/TIE.2012.2194974 DOI: https://doi.org/10.1109/TIE.2012.2194974
S. K. Chaudhary, A. F. Cupertino, R. Teodorescu, J. R. Svensson, "Benchmarking of Modular Multilevel Converter Topologies for ES-STATCOM Realization", Energies, vol. 13, no. 13, jul. 2020. https://doi.org/10.3390/en13133384 DOI: https://doi.org/10.3390/en13133384
D. G. Holmes, T. Lipo, B. Mcgrath, W. Kong, "Optimized Design of Stationary Frame Three Phase AC Current Regulators", IEEE Trans on Power Electron, vol. 24, pp. 2417-2426, nov. 2009. https://doi.org/10.1109/TPEL.2009.2029548 DOI: https://doi.org/10.1109/TPEL.2009.2029548
R. Pe ̃na-Alzola, M. Liserre, F. Blaabjerg, M. Ordonez, Y. Yang, "LCL-Filter Design for Robust Active Damping in Grid-Connected Converters", IEEE Trans on Ind Informatics, vol. 10, no. 4, pp. 2192-2203, oct. 2014. https://doi.org/10.1109/TII.2014.2361604 DOI: https://doi.org/10.1109/TII.2014.2361604
Downloads
Published
How to Cite
Issue
Section
License
Copyright (c) 2022 Revista Eletrônica de Potência
This work is licensed under a Creative Commons Attribution 4.0 International License.