Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic Methods

Authors

DOI:

https://doi.org/10.18618/REP.e202510

Keywords:

Thermal Impedance Characterization, IGBT Module Reliability, Virtual Junction Temperature Measurement, Thermoelectric Characterization

Abstract

This study evaluates IGBT modules with a focus on efficiently measuring their thermal impedance, a critical factor in reliability assessments. The research employs the Thermo Electric Sensitive Parameter method to measure the Virtual Junction Temperature and obtain the Thermal Impedance curve. These experimental results are compared with datasheet values, using power modules without a baseplate. Two methodologies, dynamic and static, are utilized, both demonstrating consistent performance in evaluating thermal characteristics. The study also addresses the importance of accounting for non-linearity in thermal conductance due to temperature dependency, which is essential for accurate thermal characterization. Additionally, it explores the potential for measuring the Thermal Impedance between Junction and Case in power modules without a baseplate, offering a comprehensive understanding of thermal performance.

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Author Biographies

Deivid F. de Souza , Universidade Federal de Santa Catarina

was born in 1995 in Criciuma, graduated in Physics from Santa Catarina State University (UDESC) in 2021 and is currently working on his M.S. degree in the Graduate Program in Electronic Systems Engineering at the Federal University of Santa Catarina (UFSC). His current research interests are in the reliability of power electronics, power modules, and the characterization of electronic devices.

Diego S. Greff, Universidade Federal de Santa Catarina

received the B.S. and M.S. degrees in electrical engineering from the Federal University of Santa Maria (UFSM) in 1997 and 1999 respectively, and Ph.D. in electrical engineering from the Federal University of Santa Catarina (UFSC) in 2009. He worked for 11 years in the multinational companies like TDK, Renault and Whirlpool, developing engineering products, managing global projects and managing engineering teams. Since 2014, he is lecturer, and since 2020 he is director, at the Federal University of Santa Catarina on the Joinville Campus and a member of the Research Group on Drives and Control of Mechatronic Systems. He has large experience in the area of electrical engineering, with an emphasis on Power Electronics, working mainly on the following subjects: static converters, three-phase PWM rectifiers, power factor correction, research, development, and application of embedded electronics, diagnosis of electrical machines and reliability of power electronics devices.

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Published

2025-01-22

How to Cite

[1]
D. F. de Souza and D. S. Greff, “Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic Methods”, Eletrônica de Potência, vol. 30, p. e202510, Jan. 2025.

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Original Papers